MicroMemory is a series of memory modules for embedded devices with memory bus widths less than 64 bits.
Versions
HyperRAM
Intended applications for SDRAM MicroMemory are microcontrollers and FPGAs.
EEPROM
HyperRAM MicroMemory modules contain a 1Kbit I2C EEPROM for 128 Bytes of configuration data.
SPI PSRAM
Intended applications for SDRAM MicroMemory are microcontrollers.
EEPROM
SPI PSRAM MicroMemory modules contain a 1Kbit I2C EEPROM for 128 Bytes of configuration data.
SDRAM
SDRAM is the first memory standard that a MicroMemory module was designed for.
Intended applications for SDRAM MicroMemory are microcontrollers, FPGAs, microprocessors and DSPs.
EEPROM
SDRAM MicroMemory modules contain a 1Kbit I2C EEPROM for 128 Bytes of configuration data.
DDR
Intended applications for DDR MicroMemory are FPGAs, microprocessors and DSPs.
EEPROM
DDR MicroMemory modules contain a 1Kbit I2C EEPROM for 128 Bytes of configuration data.
DDR2
Intended applications for DDR2 MicroMemory are FPGAs, microprocessors, SoCs and DSPs.
EEPROM
DDR2 MicroMemory modules contain a 1Kbit I2C EEPROM for 128 Bytes of configuration data.
DDR3
Intended applications for DDR3 MicroMemory are FPGAs, microprocessors and SoCs.
EEPROM
DDR3 MicroMemory modules contain a 2Kbit I2C EEPROM for 256 Bytes of configuration data.
DDR4
Intended applications for DDR4 MicroMemory are FPGAs, microprocessors and SoCs.
EEPROM
DDR4 MicroMemory modules contain a 4Kbit I2C EEPROM for 512 Bytes of configuration data.
Naming Scheme
AABCCDDEEFGHH-IIIJKKKKLLMN
- AA - Always "MM" for MicroMemory
- B - Memory type
- E - EDO DRAM
- F - FPM DRAM
- H - HyperRAM
- S - SPI PSRAM
- 0 - SDRAM
- 1 - DDR
- 2 - DDR2
- 3 - DDR3
- 4 - DDR4
- 5 - DDR5
- CC - Bus width
- 01 - 1-bit
- 02 - 2-bit
- 04 - 4-bit
- 08 - 8-bit
- 16 - 16-bit
- 32 - 32-bit
- 40 - 40-bit (32-bit + 8-bit ECC)
- DD - Device bit width
- 01 - 1-bit
- 02 - 2-bit
- 04 - 4-bit
- 08 - 8-bit
- 16 - 16-bit
- 32 - 32-bit
- E - Rank count
- FFFF - Device package type
- BGAX - BGA
- NSOC - SOIC (0.150 Inch)
- SSON - SON
- SSOP - SOP (0.150 Inch)
- TSSP - TSSOP
- TTSP - TSOP
- USON - USON
- WSOC - SOIC-Wide (0.300 Inch)
- GG - Device package pin count
- H - Signaling
- S - Single Data Rate (SDR)
- D - Double Data Rate (DDR)
- Q - Quadruple Data Rate (QDR)
- 4 - PAM4
- I - Module format
- C - Mezzanine connector
- M - M.2
- S - Standard SODIMM
- Separator
- JJJ - Total Capacity
- 001
- 002
- 004
- 008
- 012
- 016
- 024
- 032
- 048
- 064
- 128
- 256
- 384
- 512
- K - Total Capacity Multiplier
- B - Byte (1)
- K - Kilobyte (1024)
- M - Megabyte (1048576)
- G - Gigabyte (1073741824)
- LLLL - Maximum frequency, in MHz
- 0001 - 1 MHz
- 1600 - 1600 MHz (for example: DDR4-3200)
- MM - Device Vendor
- AM - AMD
- CY - Cypress
- CX - CXMT
- EE - Elpida
- HX - Hyundai/Hynix/SK hynix
- IM - Intelligent Memory
- IS - ISSI
- IT - Intel
- IQ - Qimonda
- IX - Infineon
- LG - LG/GoldStar
- MI - Mitsubishi
- MP - Mosel Vitelic/ProMOS
- MT - Micron Technology
- NT - Nanya Technology
- PC - Powerchip
- SE - Samsung
- WB - Winbond
- N - Vendor DRAM die revision
- A - A-die/Rev. A
- ...
- Z - Z-die/Rev. Z
- O - Special feature
- X - None
- E - On-die ECC
-JJJKLLLLMMNO is assigned to specific units. It is omitted in PCB design.
As MicroMemory covers legacy memory formats and may reuse parts from existing hardware, former DRAM vendors are included.